Light-emitting diodes have become very popular in general lighting due to
their various advantages over other luminaires. Power consumption and LED size also
play an important part in their selection over CFL’s. LEDs are compact and brighter
and can be modelled according to the requirement. Due to the compact size of highpower
LEDs, the temperature or heat produced by the LEDs will be more, so some
efficient cooling methods must be employed. This paper compares heat dissipation
through heat sinks of different sizes. This paper claims that the temperature of highpower
LEDs cannot be lowered after reaching a certain point, as a result, an increase in
the size of the heat sink at that particular level is useless.
Keywords: Fin Thickness, Heat Dissipation, High-Power LED (Light Emitting
Diode), Heat Sink, Thermal Behavior.
