Global Emerging Innovation Summit (GEIS-2021)

A Review on Health Monitoring of Electronic Passive Components

Author(s): Raghav Gupta, Cherry Bhargava* and Amit Sachdeva *

Pp: 138-144 (7)

DOI: 10.2174/9781681089010121010017


The development of Technology in the field of electronic devices is going very rapidly. Factors such as cost, performance, complexity, and portability are contemplated over and over again. Nowadays low cost and better performance captivate the interest of a wide range of public. To meet these demands of the public various components are integrated onto a single chip. As this integration increases, the complexity of the devices increases which leads to increased chances of faults and failures in a device. It is not that today’s urban human is using the electronics keeping hi-tech gadgets in hand, but today’s mechanical transport means are also driven by daily changing and improved electronics devices. So many times, there are recalls of sold components or devices by leading electronics giants due to post prediction of their failure. This happens because the companies are using traditional techniques for condition monitoring and reliability testing. Even big automobile giants have to recall their cars for defects occurring in the later stage. One of the examples of recalling of TATA public transport buses sold to DTC in Delhi, India, as those automobiles are getting caught in the fire in many cases. Traditionally, to analyze electronic components reliability and condition monitoring, three techniques are used, viz., using empirical methods including standard handbooks MILHDBK-217, BELLCORE, and PRISM; analyzing using life testing experiments; collect maintenance and operating data and perform statistical analysis.

Keywords: Failure Prediction, Failure Rate, Faults, Reliability.

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