Home Page ::: Neuroscience and Biomedical Engineering

ISSN: 2213-3860 (Online)
ISSN: 2213-3852 (Print)

Volume 3, 2 Issues, 2015

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Neuroscience and Biomedical Engineering

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Forthcoming Special Issue(s)

Modeling, Measurement, and Application of Brain Interstitial Space

Guest Editor(s): Hongbin HAN, Yiming LEI
Tentative Publication Date: April, 2016
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Authors' Comments
I am glad to have chosen Bentham Science Publishers to disseminate my work. The review process of Neuroscience and Biomedical Engineering was swift, fair and - most importantly - open to an unconventional scientific development. Thus, rather than simply paying lip service, this journal truly provides a forum of cutting edge interdisciplinary research that has the potential of high practical significance.

Dr. Rainer Schneider
(The RECON – Research and Consulting, Unterer Mühlenweg 38 B 79114, Freiburg, Germany)

Has contributed: Getting in sync: A new Ready-to-use Biofield Resonance Device (Vita Chip) Reduces Chronic Pain and Increases Wellbeing

Neuroscience and Biomedical Engineering


Volume 3


Number 2


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