Editorial Board ::: Recent Patents on Engineering

ISSN: 2212-4047 (Online)
ISSN: 1872-2121 (Print)


Volume 10, 3 Issues, 2016


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Recent Patents on Engineering

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Editor-in-Chief:
Nan Chi
The School of Information Science and Engineering
Fudan University
Shanghai
China


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Editorial Board

Editor-in-Chief:

Nan Chi
The School of Information Science and Engineering
Fudan University
Shanghai
China



Regional Editor(s):

Jinde Cao
King Abdulaziz University, Department of Mathematics
Jeddah
Saudi Arabia

M.A. Meireles
State University of Campinas
Campinas
Brazil

Hongli Dong
School of Electrical and Information Engineering, Northeast Petroleum University
Daqing
P. R. China

Evangelos J. Sapountzakis
University of Athens
Athens
Greece

Yan-Jun Liu
College of Science, Liaoning University of Technology
Jinzhou
China


Associate Editor(s):

Zhitao Kang
Georgia Tech Research Institute
1473 Willow Lake Dr, Apt C
Atlanta, GA
USA

Cengiz kahraman
Istanbul Technical University
Istanbul
Turkey

Xingying Li
Georgia Institute of Technology
Atlanta, GA
USA

Zeshui Xu
Sichuan University
Chengdu
China


Editorial Board Members:

Tofigh Allahviranloo
Daneshgahe Azad Eslami, Science and Research Branch
Tehran
Iran

A. Astolfi
Imperial College London
London
UK

A. Barakat
University of California
Davis, CA
USA

W. Budzianowski
Wroclaw University of Technology
Wroclaw
Poland

C.C. Chang
Feng Chia University
Taichung
Taiwan

K.W. Chau
The Hong Kong Polytechnic University
Hunghom
Hong Kong

X.D. Chen
Monash University
Melbourne
Australia

S. Comani
University "G. d'Annunzio"
Chieti
Italy

L. Dascalescu
Inst. Univ. Technologie D'Angouleme- ENSMA
Angoulême cedex
France

A. Denizli
Hacettepe University
Ankara
Turkey

I. Dincer
UOIT
Ontario
Canada

H. Djojodihardjo
Universiti Putra Malaysia
Selangor
Malaysia

H. Du
Northumbria University
Newcastle
UK

Q-.H. Fang
Hunan University
Changsha
P.R. China

S. Gao
Northumbria University
Newcastle
UK

J. Gu
Carleton University
Ottawa
Canada

O. Gulnaz
Cukurova University
Adana
Turkey

J. He
Peking University
Beijing
China

K.P. Ho
National. Taiwan University
Taipei
Taiwan

Y.Y. Huang
University of Illinois at Urbana-Champaign
Urbana, IL
USA

M. Janus
Szczecin University of Technology
Szczecin
Poland

N. Kalogerakis
Technical University of Crete
Chania
Greece

M.D. Ker
National Chiao-Tung University
Taiwan

G.M. Kontogeorgis
Technical University of Denmark
Kongens Lyngby
Denmark

A. Kusiak
The University of Iowa
Iowa, IA
USA

H. Lee
Korea University
Seoul
Korea

Q.S. Li
City University of Hong Kong
Kowloon
Hong Kong

H. Liu
Intel Corporation
Santa Clara, CA
USA

H.D. Mansilla
University of Concepcion
Concepcion
Chile

G.L. Matloff
New York City College of Technol.
New York, NY
USA

M. Moszynski
Soltan Inst. for Nuclear Studies
Otwock-Swierk
Poland

M.G. Na
Chosun University
Gwangju
North Korea

S.D. Nobile
University of Foggia
Foggia
Italy

C.T. Pan
Nat. Sun Yat-Sen University
Kaohsiung
Taiwan

G. Provenzano
Dipartimento ITAF
Palermo
Italy

S. Ramtani
University of Paris
Paris
France

E. Rosenberg
AT&T Lab
Middletown, NJ
USA

E.J. Sapountzakis
National Technical University of Athens
Athens
Greece

J.W. Shi
National Ctr. University
Taoyuan
Taiwan

S. Sombra
UFC
Fortaleza- Ceará-Brazil

S.S. Su
Biosensors International
Newport Beach, CA
USA

H. Sunan
National University of Singapore
Singapore

L.K. Teong
Universiti Sains Malaysia
Penang
Malaysia

M. Turek
Silesian University of Technol
Gliwice
Poland

Q.-G. Wang
University of Johannesburg
Johannesburg
South Africa

C. Wanji
Dalian University of Technology
Dalian
China

S. Wu
The University of Kent
Canterbury
United Kingdom

Y. Xiao
The University of Alabama
Tuscaloosa, AL
USA

L. Xu
University of Waterloo
Ontario
Canada

D. Yao
University of Electronic Sci. and Technology of China
Chengdu
China

Y. Yu
Chongqing University
Chongqing
China

J. Zheng
Nanyang Technological University
Singapore

W.B. Zimmerman
University of Sheffield
Sheffield
UK

J. Alonso
University of Oviedo
Asturias
Spain

B. Atzori
University of Padua
Padova
Italy

R. Barbucci
University of Siena
Siena
Italy

Y. Cao
Beijing University of Aeronautics and Astronautics
Beijing
China

J. Chang
Chinese Academy of Science
Shanghai
China

C.H. Chen
Nanyang Technol. University
Singapore
Singapore

L.W.H. Cheung
The Chinese University of Hong Kong
Shatin
Hong Kong

P. Dagaut
CNRS, Lab of Combustion and Systems Reactive
Orleans
France

A. Deletic
Monash University
Melbourne
Australia

S. Devahastin
University of Technol. Thonburi
Bangkok
Thailand

G. Ding
Shanghai Jiaotong University
Shanghai
China

T. Dogu
Middle Easty Technical University
Ankara
Turkey

P. Englezos
University of British Columbia
Vancouver
Canada

M. Fatemi
Mayo Clinic College of Med
Rochester, MN
USA

G. Ghinea
Brunel University
London
UK

R.G. Guidoin
Laval University
Quebec
Canada

V.K. Gupta
Indian Inst. of Technology
Roorkee
India

S. Hernandez
University of Coruna
Coruna
Spain

B. Huang
University of Alberta
Alberta
Canada

R.R. Hussain
King Saud University
Riyadh
Saudi Arabia

Y.R. Jeng
National Chung Cheng University
Chiayi
Taiwan

A.E. Kampitsis
School of Civil Engineering NTUA
Athens
Greece

M.H. Kim
Kyungpook National University
Daegu
South Korea

V. Kosarev
Khristianovich Inst. of Theoretical and Appl. Mech
Novosibirsk
Russia

W. Kwong
Hofstra University, Hofstra
Hempstead, NY
USA

J.H. Lee
University of Cincinnati
Cincinnati, OH
USA

R. Li
Georgia Inst. of Technol
Atlanta, GA
USA

Z. Ma
University of Wollongong
Wollongong
Australia

F.D. Maria
Dip. di Ingegneria Industriale
Perugia
Italy

F. Mendez
University Nacional Autonoma of Mexico
Coyoacan
Mexico

P. Moulin
University Paul Cézanne
Marseille
France

K.G. Neoh
National University of Singapore
Singapore

A. Noore
West Virginia University
Morgantown, WV
USA

J. Pou
University of Vigo
Santiago
Italy

L. Qin
The Chinese University of Hong Kong
Hong Kong

S. Ray
University of Calcutta
Kolkata
India

R. Rusli
Nanyang Technological University
Singapore

A.K. Sarma
Tezpur University
Tezpur
India

F.Y. Shih
New Jersey Inst. of Technol
New Jersey, NJ
USA

G.A. Sorial
University of Cincinnati
Ohio, OH
USA

T. Sugahara
Osaka University
Toyonaka
Japan

K.C. Tan
National University of Singapore
Singapore

B. Tohidi
Heriot-Watt University
Edinburgh
UK

G. Vozzi
University of Pisa
Pisa
Italy

S. Wang
The Hong Kong Polytechnic University
Kowloon
Hong Kong

S. Wongwises
King Mongkut’s University of Technology Thonburi
Bangkok
Thailand

F. Xi
Ryerson University
Toronto
Canada

W.F. Xie
Jilin University
Changchun
China

T. Xu
University of Sci. and Technol. of China
Hefei
China

S. Yaşyerli
Gazi University
Ankara
Turkey

D. Zhang
Hong Kong Polytechnic University
Kowloon
Hong Kong

Z.W. Zhong
Nanyang Technol. University
Nanyang
Singapore

A. Zouboulis
Aristotle University
Thessaloniki
Greece

B. Alzahabi
Kettering University
Michigan, MI
USA

M.J. Bagajewicz
University of Oklahoma
Norman, OK
USA

J.F. Blais
Inst. National de la Recherche Scientifique
Quebec
Canada

J. Capmany
Instituto De Telecomunicaciones Y Aplicaciones Multimedia (Iteam)
Valencia
Spain

P. Chang
Yuan-Ze University
Taoyuan
Taiwan

C.N. Chen
National Cheng Kung University
Tainan
Taiwan

W. Chu
The Hong Kong Polytechnic University
Kowloon
Hong Kong

T.N. Dantas
University Fed. do Rio Grande do N
Natal
Brazil

A. Demirbas
Selcuk University
Konya
Turkey

I.E. Dikaros
School of Civil Engineering NTUA
Athens
Greece

Y. Ding
University of Leeds
Leeds
UK

J.A. Dourakopoulos
Institute of Structural Analysis and Antiseismic Research of NTUA
Athens
Greece

M. Fan
Georgia Inst. of Technology
Georgia, GA
USA

R.E. Filman
Google Inc
California, CA
USA

H. Grant
University of Strathclyde
Glasgow
UK

I. Guler
Gazi University
Ankara
Turkey

Q.L Han
Ctr. Queensland University
Rockhampton
Australia

W.N. Hien
National University of Singapore
Singapore
Singapore

C.H. Huang
National Cheng Kung University
Tainan
Taiwan

Dušanka Janežič
University of Primorska
Koper
Slovenia

G. Juncu
University Politechnica of Bucharest
Bucharest
Romania

S. Kara
Erciyes University
Kayseri
Turkey

Z. Knez
University of Maribor
Maribor
Slovenia

D. Kujawski
Western Michigan University
Kalamazoo, MI
USA

S.S. Law
The Hong Kong Polytechnic University
Kowloon
Hong Kong

A. Leung
City University of Hong Kong
Kowloon
Hong Kong

C.W. Lim
National Taiwan University
Taipei
Taiwan

P.-C. Ma
The Xinjiang Technical Institute of Physics and Chemistry
Beijing
China

J.M. Martín-Martínez
University of Alicante
Alicante
Spain

A.R. Mohamed
Universiti Sains Malaysia
Pulau Pinang
Malaysia

J. Murin
Slovak University of Technology
Trnava
Slovakia

C.T. Nguyen
Université de Moncton
Moncton
Canada

B. Pan
Nanjing University
Nanjing
China

F. Pourboghrat
Michigan State University
Michigan, MI
USA

M. Radosz
University of Wyoming
Laramie, WY
USA

C. Ronco
San Bortolo Hospital
Vicenza
Italy

H. Sadat
Higher School Engineers of Poitiers
Poitiers
France

R. Savino
University of Napoli Federico II
Tecchio, Napoli
Italy

V. Singh
Atilim University
Ankara
Turkey

D. Spinellis
AUEB
Athens
Greece

W. Sun
Drexel University
Philadelphia, PA
USA

P.A. Tanguy
URPEI
Montreal
Canada

A.-D.G. Tsonos
Aristotle University of Thessaloniki
Thessaloniki
Greece

R.J. Wai
National Taiwan University of Science and Technology
Taiwan

Z. Wang
Brunel University
Middlesex
UK

C. Wu
Shanghai Institute of Ceramics
Shanghai
China

H. Xiao
University of New Brunswick
New Brunswick
Canada

C. Xu
Underground System, Inc
Armonk, NY
USA

L. Yan
University of Southern California
California, CA
USA

D.L. Young
National Taiwan University
Taipei
Taiwan

Y. Zhang
National University of Singapore
Singapore

J. Zhu
The University of Western Ontario
Ontario
Canada


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