Editorial Board ::: International Journal of Sensors, Wireless Communications and Control

ISSN: 2210-3287 (Online)
ISSN: 2210-3279 (Print)


Volume 5, 2 Issues, 2015


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International Journal of Sensors, Wireless Communications and Control

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Editor-in-Chief:
Sing Kiong Nguang
Dept. of Electrical and Computer Engineering
The University of Auckland
Auckland City
New Zealand


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Editorial Board

Editor-in-Chief:

Sing Kiong Nguang
Dept. of Electrical and Computer Engineering
The University of Auckland
Auckland City
New Zealand



Co-Editor(s):

Dan Huang
Department of Automation
Shanghai Jiao Tong University
Shanghai
China


Associate Editor(s):

Amjad Gawanmeh
Khalifa University of Science
Sharjah, UAE

Jiwei Wen
Key Laboratory of Advanced Process Control for Light Industry
Jiangnan University, Jiangsu
China

Shafiullah Khan
Kohat University of Science and Technology (KUST)
Kohat, Pakistan

Hassan Moradi
Qualcomm Technologies Inc.
San Diego, CA
USA


Editorial Board Members:

D. Accardo
University of Naples
Naples, Italy

X. Guan
Shanghai Jiao Tong University
Shanghai, China

J. Lam
The University of Hong Kong
Pok Fu Lam, Hong Kong

K. Makki
Lamar University
Texas, USA

J. Raisch
Technische Universitaet Berlin
Berlin, Germany

C.-Y Su
Concordia University
Montréal, QC
Canada

M. Xiao
Southern Illinois University
Carbondale, IL
USA

D.-W. Yue
Dalian Maritime University
Dalian, China

M. Basin
Autonomous University of Nuevo Leon
San Nicolás de Los Garza, Mexico

Q.-L Han
Central Queensland University
Rockhampton, Australia

C. Lin
Qingdao University
Qingdao, China

A.A. Martynyuk
National Academy of Sciences of Ukraine
Kiev, Ukraine

P. Shi
University of Glamorgan
Pontypridd, UK

A. Swain
University of Auckland
Auckland, New Zealand

W. Xiao
Institute for Infocomm Research
Singapore

A.L. Brooks
Aalborg University Esbjerg
Niels Bohrs vej, Denmark

C. Hua
Yanshan University
Qinhuangdao
China

F. Liu
Jiangnan University
Jiangsu, China

N.T. Nguyen
Wroclaw University of Technology
Wrocław, Poland

Y. Shi
School of Industrial Engineering, Tokai University
Toroku, Kumamoto, Japan

Y. Xia
Beijing Institute of Technology
Beijing, China

E.E. Yaz
Marquette University
WI, USA


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